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SOT-563(1)
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  • Brand: TI
    Encapsulation: SOT-563
    Category: Development kit
    Description: DIP Adapter board, used for SMT packaging of Texas Instruments DIP adapter board, can provide a low-cost solution for solving the problem of small surface mount IC packaging in prototype design. This board can be directly connected to existing circuits or used with suitable terminal clamps. Supports the following encapsulation types: SOIC-8 (D or U), TSSOP-8 (PW), MSOP-8 (DGK), SOT23-3, SOT23-5 and SOT23-6 (DBV), SC70-5 and SC70-6 (DCK), and SOT563-6 (DRL). ###Adapter and converter board
    3125

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